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Organoclay for Adhesives & Sealants

Thixotropic organoclay that prevents vertical joint sag, enables clean cartridge dispensing, and suspends heavy fillers throughout shelf life — in polyurethane, epoxy, silicone, MS polymer, polysulfide, and bituminous adhesive and sealant systems.

Organoclay thixotropic agent for adhesives and sealants — organophilic clay powder with colored adhesive and sealant formulations

Where We Supply — Adhesive & Sealant Markets

Our adhesive and sealant customers are concentrated in South Korea, Canada, Brazil, Argentina, Colombia, and Russia. The application requirements across these markets share a common thread: non-sag performance on vertical and overhead joints before cure, combined with clean, consistent cartridge dispensing that does not harden or phase-separate during shelf life.

One observation from our field experience: the grade selection logic for adhesives and sealants is closely parallel to lubricating grease formulation. Both require the organoclay to build a stable thixotropic structure in a viscous oil or resin base — and the same grades that work well in grease systems (CP-34, CP-RL, CP-388, CP-250A, CP-31, CP-992) translate directly to construction sealants, automotive adhesives, and industrial bonding systems. If you already use one of these grades in a grease application, the starting point for your sealant formulation is the same grade at a similar treat rate.

Core Functions in Adhesives & Sealants

Organoclay in adhesives and sealants: A thixotropic rheology modifier that builds a recoverable gel network in solvent-based and reactive formulations. At rest: high yield point holds applied bead in position without sagging. Under dispensing pressure: network collapses, allowing clean extrusion from cartridge or gun. After application: network rebuilds rapidly — bead holds geometry until cure. Effective at 0.5–3.0 wt%.
FunctionMechanismPractical Impact
Anti-sagGel network yield point exceeds gravitational stress on applied beadApplied bead stays in place on vertical joints, overhead surfaces; passes ASTM C639 slump <3mm
Thixotropic dispensingGel breaks down under cartridge gun pressure; recovers after dispensingEasy extrusion even from cold storage; bead holds shape immediately after gun withdrawal
Filler suspensionGel network immobilizes CaCO₃, silica, TiO₂, BaSO₄ at restConsistent filler distribution throughout 1–2 year shelf life; no hard-pack in cartridge base
Film reinforcementClay platelets align in curing polymer matrixImproved tensile strength, elongation, barrier to moisture and gases; better adhesion at bond line

Applicable System Types

Adhesive / Sealant SystemPolarityRecommended GradeDosage
Epoxy adhesives (aromatic amine cure)Medium–highCP-APA, CP-MP, CP-340.5–2.0 wt%
Epoxy adhesives (aliphatic amine cure)MediumCP-34, CP-APA0.5–1.5 wt%
Polyurethane sealants (1-part, 2-part)Medium–highCP-APA, CP-EDS, CP-MP1.0–2.5 wt%
Silicone sealants (RTV)Low–mediumCP-EL, CP-GL, CP-341.0–2.5 wt%
MS polymer / modified siliconeMediumCP-APA, CP-MP1.0–2.0 wt%
Polysulfide sealantsMediumCP-34, CP-APA0.5–1.5 wt%
Acrylic adhesives (solvent-based)MediumCP-10, CP-340.5–1.5 wt%
Construction adhesivesLow–mediumCP-34, CP-400.5–2.0 wt%
Bituminous masticsLowCP-34, CP-401.0–3.0 wt%
Unsaturated polyester (UP) putty / body fillerMedium (styrene)CP-34, CP-401.0–2.5 wt%

Dosage Guide — Non-Sag Performance

Application RequirementOrganoclay Dosage (CP-APA or CP-34)Target Yield Point
Light adhesive, moderate thixotropy0.5–1.0 wt%10–20 Pa
Construction sealant, vertical joint1.0–2.0 wt%20–40 Pa
1-component cartridge, maximum non-sag2.0–3.0 wt%40–80 Pa
ASTM C639 slump <3 mm (standard non-sag test)1.0–1.5 wt% typical≥20 Pa

Incorporation Methods

Two-Part Epoxy Systems — Add to Part A Only

  1. Add base epoxy resin to mixing vessel
  2. Add organoclay powder under agitation
  3. Mix at high shear (Cowles disperser, 15–20 min)
  4. Add polar activator if using conventional grade (ethanol or propylene carbonate at 30–40% of organoclay weight)
  5. Mix for additional 15 minutes
  6. Add fillers (calcium carbonate, silica) and mix to homogeneity
  7. Package as Part A

Critical: Never add organoclay to the curing agent (Part B) — amine or anhydride curing agents interfere with activation chemistry and prevent proper gel formation.

One-Component Polyurethane / MS Polymer Sealants

  1. Charge base polymer resin to planetary mixer or dissolver
  2. Add organoclay under agitation with polar activator (for conventional grades)
  3. Disperse at high shear for 15–20 minutes in dry, moisture-free conditions
  4. Add fillers (CaCO₃, TiO₂, silica) and mix
  5. Add adhesion promoter, UV stabilizer, and other additives
  6. Degas under vacuum before packaging in cartridges

Silicone Sealants

  1. Add organoclay (low-polarity grade: CP-EL or CP-GL) to silicone oil phase
  2. Add polar activator (ethanol at 30–40% of organoclay weight)
  3. Mix at high shear for 15–20 minutes
  4. Add crosslinker and catalyst separately — do not mix with organoclay under shear simultaneously
  5. Test compatibility: some silicone crosslinker chemistries may interact with organoclay — run compatibility screening on the full formulation

Frequently Asked Questions

What is organoclay used for in adhesives and sealants?
Organoclay provides thixotropic anti-sag performance (applied bead holds on vertical surfaces before cure), enables clean cartridge dispensing under pressure, suspends heavy fillers throughout shelf life, and reinforces the cured adhesive film through platelet alignment. Effective at 0.5–3.0 wt% in PU, epoxy, silicone, MS polymer, polysulfide, and bituminous systems.
What is the difference between bentonite and organoclay in sealants?
Bentonite is hydrophilic — used in water-swelling waterproofing membranes and underground sealing applications. Organoclay is organophilic modified bentonite — it disperses in solvent-based, reactive, and oil-continuous sealant systems (PU, epoxy, silicone, polysulfide) and provides the anti-sag and filler suspension performance that bentonite cannot deliver in non-aqueous formulations.
How much organoclay do I need in a sealant?
Lightly filled adhesives: 0.5–1.0 wt%. Construction sealants on vertical joints: 1.0–2.0 wt%. One-component cartridge sealants (maximum non-sag): 2.0–3.0 wt%. Target yield point ≥20 Pa for ASTM C639 slump <3mm. Start at 1.0 wt%, measure slump after 24h, adjust as needed.
Which organoclay grade is best for epoxy adhesives?
Add organoclay to Part A (resin) only — never to Part B (curing agent). Best grades: CP-APA (self-activating, simplest processing for aromatic amine epoxy); CP-MP or CP-EDS (fine particle ≤10 μm, smooth texture); CP-34 (highest gel strength for heavily filled systems). Dosage: 0.5–2.0 wt% in Part A.
Does organoclay work in silicone sealants?
Yes. Use low-polarity grades: CP-EL, CP-GL, or CP-34 at 1.0–2.5 wt%. Disperse in silicone oil phase with polar activator before adding crosslinker. Some silicone crosslinker chemistries may interact — always run compatibility screening on the full formulation before production scale-up.
What is organoclay used for?
Organoclay is used as a thixotropic rheology modifier in: solvent-based paints (anti-settling, anti-sagging); oil-based drilling fluids (viscosity building, barite sag prevention); lubricating greases (clay thickener, no drop point); printing inks (anti-settling, anti-misting); adhesives and sealants (anti-sag, filler suspension); cosmetics (pigment suspension, skin feel); and water treatment (contaminant adsorption). Full overview →

Recommended grades for adhesives & sealants: CP-APA (self-activating, ketone/ester systems) · CP-27A (high-polarity epoxy sealants) · CP-VZ (polyurethane & epoxy, ≤20μm) · CP-34 (aromatic systems, with activator)

Related pages: Anti-Sagging Agent · Viscosity Control · Organoclay for Coatings

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